Committed to a sustainable future
Restriction of Hazardous Substances (RoHS)
We actively reduce hazardous materials found in electrical and electronic equipment. Our “lead-free directive” includes the reduction of the following harmful substances.
- Lead (Pb)
- Mercury (Hg)
- Cadmium (Cd)
- Hexavalent chromium (Cr6+)
- Polybrominated biphenyls (PBB)
- Polybrominated diphenyl ether (PBDE)
- Bis(2-ethylhexyl) phthalate (DEHP)
- Butyl benzyl phthalate (BBP)
- Dibutyl phthalate (DBP)
- Diisobutyl phthalate (DIBP)
Business Recycling Awards Group
Distinguished BRAG Members have met the following criteria:
- Recycle all prevalent materials regularly
- Prevent waste with at least 6 ongoing activities
- Consistently buy recycled copier/printer paper and other products
- Demonstrate a commitment to the continuous improvement of waste reduction, recycling, and buy recycled efforts.
Striving for a cleaner future
EMS meets the European Union’s RoHS Directive
The European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS) bans the use of cadmium, hexavalent chromium, lead, mercury, PBBs (polybrominated biphenyls), and PBDEs (polybrominated diphenyl ethers) in electronic product and components. This policy went into effect in July 2006. Due to environmental concerns, the need for lead-free solutions in electronic components and systems has received considerable attention within the semiconductor and electronics industries.
Digital Control Systems, Inc. (DCS) and many of our customers are affected by this legislation, in particular as it relates to lead in soldering materials. This legislation is similar to the Chlorofluorocarbon (CFC) elimination requirements but the impact of lead-free solders is much wider than the effects caused by CFC elimination. Lead is a major constituent in traditional tin-lead solders.
Material compatibility issues are the primary concern with moving to lead-free components and solders. Certain alloys, when used on a component or board coated with lead-tin solder, can form intermetallics, which will reduce the resulting solder joints mechanical integrity. Alternative lead-free solder alloys are being developed, but their introduction into electronics manufacturing has been slow due to the major changes to current manufacturing processes, electronic components, and inspection requirements.
The European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS) bans the use of cadmium, hexavalent chromium, lead, mercury, PBBs (polybrominated biphenyls), and PBDEs (polybrominated diphenyl ethers) in electronic product and components. This policy went into effect in July 2006. Due to environmental concerns, the need for lead-free solutions in electronic components and systems has received considerable attention within the semiconductor and electronics industries.
Digital Control Systems, Inc. (DCS) and many of our customers are affected by this legislation, in particular as it relates to lead in soldering materials. This legislation is similar to the Chlorofluorocarbon (CFC) elimination requirements but the impact of lead free solders is much wider than the effects caused by CFC elimination. Lead is a major constituent in traditional tin-lead solders.
Material compatibility issues are the primary concern with moving to lead-free components and solders. Certain alloys, when used on a component or board coated with lead-tin solder, can form intermetallics, which will reduce the resulting solder joints mechanical integrity. Alternative lead-free solder alloys are being developed, but their introduction into electronics manufacturing has been slow due to the major changes to current manufacturing processes, electronic components, and inspection requirements.
The European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS) bans the use of cadmium, hexavalent chromium, lead, mercury, PBBs (polybrominated biphenyls), and PBDEs (polybrominated diphenyl ethers) in electronic product and components. This policy went into effect in July 2006. Due to environmental concerns, the need for lead-free solutions in electronic components and systems has received considerable attention within the semiconductor and electronics industries.
Digital Control Systems, Inc. (DCS) and many of our customers are affected by this legislation, in particular as it relates to lead in soldering matierals. This legislation is similar to the Chlorofluorocarbon (CFC) elimination requirements but the impact of lead free solders is much wider than the effects caused by CFC elimination. Lead is a major constituent in traditional tin-lead solders.
Material compatibility issues are the primary concern with moving to lead-free components and solders. Certain alloys, when used on a component or board coated with lead-tin solder, can form intermetallics, which will reduce the resulting solder joints mechanical integrity. Alternative lead-free solder alloys are being developed, but their introduction into electronics manufacturing has been slow due to the major changes to current manufacturing processes, electronic components, and inspection requirements.